IMDT V2N SoM and SBC Feature Renesas RZ/V2N MPU and DRP-AI3 Accelerator for Vision-Based Edge AI Computing

IMDT expands its Edge AI portfolio with the IMDT V2N SOM and IMDT V2N SBC, following the success of its V2H-based solutions. Powered by the Renesas RZ/V2N processor, these platforms deliver cost-effective, energy-efficient solutions for AI-driven vision applications in robotics, smart cities, industrial automation, IoT, and smart retail. The RZ/V2N features a quad-core Arm Cortex-A55 CPU running at 1.8 GHz and an integrated Renesas DRP-AI3 accelerator, ensuring optimized power consumption and affordability.

The IMDT V2N SOM comes with 8GB of RAM, 32GB of eMMC flash, and flexible storage options, including 64MB QSPI NOR flash, secure EEPROM, and a microSD card slot. It supports multiple interfaces via B2B connectors, such as two 4-lane MIPI CSI-2 interfaces and an MIPI DSI display interface, enabling seamless integration into AI vision applications.

The IMDT V2N SBC enhances connectivity with MIPI DSI or HDMI video output, dual RJ-45 Ethernet ports with optional PoE, Wi-Fi 4, and Bluetooth 5.2. Expansion options include M.2 sockets, while onboard RS-232 and CAN-FD transceivers improve industrial communication, making it a versatile solution for AI-powered Edge applications.

IMDT V2N SBC key features:

• SoM: IMDT V2N SoM
  • Processor: Renesas RZ/V2N SoC
    • Quad-core Arm Cortex-A55 @ 1.8 GHz (0.9V) / 1.1 GHz (0.8V)
    • 32KB L1 cache (I-cache with parity, D-cache with ECC) per core
    • 1MB L3 cache with ECC (max frequency 1.26 GHz)
    • Armv8-A architecture with Neon, FPU, MMU, and cryptographic extensions
• System Manager: Arm Cortex-M33 @ 200 MHz (Armv8-M)
  • AI Acceleration: Renesas DRP-AI (Up to 4 dense TOPS / 15 sparse TOPS)
  • GPU: 3D graphics engine (GE3D)
  • VPU: H.264 (1080p60), H.265 (4K30) encode & decode
• Memory and Storage:
  • 8GB LPDDR4 RAM
  • 32GB eMMC flash
  • 64MB QSPI NOR flash
  • Secure EEPROM
  • MicroSD card slot
• Display and Camera:
  • 4-lane MIPI DSI with touch interface
  • HDMI output via external DSI-to-HDMI converter
  • Dual 4-lane MIPI CSI camera interfaces
• Audio:
  • 3.5mm audio jack for stereo headset with mic
  • Onboard PDM digital microphone
• Connectivity:
  • 2x Gigabit Ethernet (1000Base-T) RJ45 jacks (optional PoE)
  • 2.4/5GHz Wi-Fi 4, dual-band + Bluetooth 5.2 BR/EDR/LE
• USB and I/O:
  • USB 3.2 Type-A port
  • USB 2.0 micro-B port
  • RS-232 transceiver
  • CAN-FD transceiver
• Sensors:
  • Temperature & humidity sensor
  • 6-DOF IMU
  • 3-axis magnetometer
• Expansion:
  • M.2 NGFF Key-E slot (Wi-Fi module or AI accelerator)
  • M.2 NGFF Key-B slot (cellular module)
  • SPI, I2C, I2S, PDM, GPIOs, and analog headers
• Debugging and Misc.:
  • JTAG / SWD debug interface
  • RTC, fan control, boot DIP switch
  • Onboard LEDs
  • Debug UART-to-USB bridge (USB-C)
• Power:
  • USB-C PD power input
  • DC jack or header
• Dimensions: 125 x 80 x 20mm

Compared to its counterpart, the IMDT Renesas V2N-based family of products features up to 15 TOPs (Sparse) AI performance, making it an ideal choice for cost-sensitive Edge AI applications.

The IMDT V2N SBC transforms the V2N SOM into a highly integrated, compact mini-computer, ideal for rapid AI application development.

IMDT has not provided details on software support for the V2N SoM and SBC. However, since both platforms are built on the Renesas RZ/V2N processor, they are likely to support the Verified Linux Package, DRP-AI Translator for AI model conversion, and GPU-accelerated rendering via RZ MPU Graphics and Video Codec libraries.

The IMDT V2N SBC is available as a kit, including two USB-C to USB-C cables for power and debugging, a full-HD USB camera, and two AR1335 MIPI cameras. The package also includes a 35W USB-C PD wall adapter with foldable US prongs and replaceable EU and UK plugs, along with an antenna for wireless connectivity. Optional accessories include a DSI-to-HDMI adapter and an HDMI cable for display output.

The company has yet to provide any pricing information about the module and SBC. For more information, refer to the official product announcement and the product page.

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